AIPMT PRELIMS 2002 Chemistry Electroplating MCQ Question
In the silver plating of copper, K[Ag(CN)₂] is used instead of AgNO₃. The reason is :-
A thin layer of Ag is formed on Cu
More voltage is required
Ag⁺ ions are completely removed from solution
Less availability of Ag⁺ ions, as Cu can not displace Ag from [Ag(CN)₂]⁻ ion
Correct Answer
Detailed Explanation
Using K[Ag(CN)₂] ensures that Ag⁺ ions are not readily available to be displaced by Cu, allowing for controlled deposition.
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